RADHARD 2021

Radiation Hardness Assurance

Abstract

PULSCAN Solution for SEE Laser Testing

Sebastien JONATHAS 1

1 PULSCAN, France

 

Abstract

This talk presents the elements and capabilities of the PULSYS-RAD equipment, Pulscan’s industrial turn-key system for pulsed laser SEE testing, which makes the pulsed laser technique accessible to non-laser-experts, with field-proven capabilities on many different IC technologies [1-6].

The main elements include the laser-injected infrared microscope and the PULSBOX Pico and 2P smart laser sources respectively for Single-Photon Absorption (SPA) and Two-Photon Absorption (TPA) testing. Some advanced features of the PULSWORKS software, which provides a complete user interface to control the laser experiment as well as for data acquisition and visualization, are presented.

Different use cases are described to illustrate the wide range of applications covered by the system for parts screening, system debug, sensitivity analysis or rad-hard design.

 

References

[1]    K. Takeuchi et al., "Single-Event Effects Induced on Atom Switch-based Field-Programmable Gate Array," in IEEE Transactions on Nuclear Science, vol. 66, no. 7, pp. 1355-1360, July 2019

[2]    S. M. Mahmood, “Investigation of Single Event Latch-up effects in the ALICE SAMPA ASIC”, TWEPP 2018, Antwerpen, Belgium

[3]    G. Allen et al., « SEE Test Results and Community Efforts”, Nasa NEPP Electronics Technology Workshop, 2019

[4]    A. Watkins et al, « Single Event Effects Characterization Using a Single Photon Absorption Laser”, 2018 IEEE AUTOTESTCON, National Harbor, MD, 2018

[5]    G. S. Rodrigues et al., "Exploring the inherent fault tolerance of successive approximation algorithms under laser fault injection," IEEE 19th Latin-American Test Symposium (LATS), Sao Paulo, 2018, pp. 1-6

[6]    J. Prinzie, J. Christiansen, P. Moreira, M. Steyaert and P. Leroux, "A 2.56-GHz SEU Radiation Hard LC -Tank VCO for High-Speed Communication Links in 65-nm CMOS Technology," in IEEE Transactions on Nuclear Science, vol. 65, no. 1, pp. 407-412, Jan. 2018