Current Developments for EMC-compliant Printed Circuit Board Design

Johannes Illenberger, Nikolaus Juch, TU Graz, Institut für Elektronik; 
Helmuth Senn, Senn System Design GmbH

Abstract

Simulation methods that provide detailed results on the behavior of electrical assemblies with regard to their EMC properties are developing rapidly. However, new manufacturing techniques for printed circuit boards, such as via-in-pad options or very small capacitors, are also expanding the possibilities for improving EMC properties.

This article attempts to briefly present new developments in this field and to demonstrate their potential using concrete examples with a comparison of simulations and real measurements. Several sample assemblies were designed, manufactured and measured for this purpose. Based on the results, a decision-making aid for PCB development is to be provided, which enables a cost-conscious use of the sometimes quite complex technologies.

In this context, an overview and discussion of best practice design guidelines provided in application notes is presented.