Enhanced Test Probes for IC EMC Characterization

​​​​​​​
​Simon Profanter, Daniel Kircher, Bernd Deutschmann
Graz University of Technology, Institute of Electronics

Poster-Abstract

ICs and electronic systems must undergo extensive electromagnetic compatibility (EMC) testing before they can be brought to market. These tests, including electromagnetic immunity, emission, and electrostatic discharge assessments, are defined by specific standards (IEC62132, IEC61967, IEC62223).

This poster addresses key challenges in EMC testing by introducing a probe test system for ICs. The effectiveness of the proposed system is demonstrated through two commonly used conducted EMC tests: Direct Power Injection (DPI) immunity testing and the 150Ω emission measurement. These tests are conducted using probes to ensure precise disturbance signal injection and measurement while enhancing testing flexibility.

The test setups are implemented using a modular system and compared to a traditional EMC test board. The results show that the modular approach extends the frequency range, increases adaptability, and reduces costs in EMC test board development.